CORWIL is recognized by the industry as a technology leader and is staffed by skilled engineers with many years of hands-on experience. The engineering staff consists of industry veterans with an average of 20 years experience in semiconductor assembly and test, including high volume manufacturing with IDM's and Asian subcontractors. CORWIL's engineers have published and presented papers and tutorials at various technical conferences worldwide.
CORWIL engineers are experts in package design, materials selection, assembly process compatibility, high yield manufacturing, and issues affecting package integrity. Our engineering team is organized by process areas, such as wafer thinning and dicing, Flip Chip, wire-bond, die picking and inspection, QFN and other plastic package assembly, and electrical test. In all these areas, the engineering team is working on the latest technologies.
In the area of dicing, CORWIL can produce ultra-thin .001" thick dice using the dice before grind (DBG) method. This is much thinner than the thickness of paper. In addition, CORWIL was one of the first companies to use Die Attach Film (DAF) which is critical for stacked die assemblies, and CORWIL now produces many millions of DAF die per month. In the area of Flip Chip, CORWIL has packaged many exotic Flip Chip designs, including ultra high bump count dice in excess of 3000 bumps. And, CORWIL has the ability to wirebond complicated ultra-fine-pitched BGA dies with multiple tiers. For next generation product development and one-of-a-kind devices, including devices with rerouted circuitry surgically done by Focused Ion Beam (FIB) or a Re-Distribution Layer of metal (RDL), customers trust CORWIL.
CORWIL's engineering resources work with customers to help identify and solve existing and potential IC packaging issues, sparing customers from costly packaging delays and failure analysis, and to develop manufacturable package solutions for high volume production. We understand that effective communication with our customers is what ensures the success of our customers' designs, proof of concepts, and final products.