Integrating with advanced technologies in epoxy-type probe cards, multi-die Probe Cards enable our customer to make full use of recent advances in ATE performance.
Improved ATE performance reduces test time and test costs, and makes parallel probing more cost effective and more sensible than ever before. When choosing the appropriate configuration for multi-die Probe Cards, the following issues must be considered:
Type of interface, size of PC boards, ratio of cutout to board size, pogo pin pressure, board trace layout, and thickness of the board. Min. pad pitch: 3mil (Center to Center) Max. no. of Die: 2 for up to 5" PCB, 4 for up to 8" PCB Max. no. of Pads per Die*: 60 (6mil pitch), 40 (5mil pitch) Max. temperature: 120°C for 2-die, 85°C for 4-Die Alignment: ±0.35mil for 2-Die, ±0.4mil for 4-Die Planarity: ±0.4mil for 2-Die, ±0.5mil for 4-Die Probe material: Tungsten, Rhenium Tungsten, J-Probe Remark: custom ceramic contoured ring required
for individual devices
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Diagonal x4
configuration
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