Vertical Contact Probe Cards are developed for multi-die probing with matrix configuration, high temperature probing (up to 150°C), C4 (array bumps) configuration, and high speed memory testing such as Rambus and SDRAM.
VCPC has various advantages over cantilever type and other types of vertical probe cards:

• Stable planarity, contact resistance, and alignment due to fixed probes with radius tips and guide plates
• Larger probing area allowed without space transformer
• Smaller probe scrub marks than those of cantilever-type probe cards
• Quicker lead time, lower costs than other types of Vertical Probe Cards since space transformer is not needed and universal boards can be used.

VCPC Scrub Mark

Cantilever Scrub Mark

Alignment Accuarcy:

±10µm (±15µm at 125°C)

Planarity:

±10µm (±15µm at 125°C)

Minimum Pitch:

118µm center to center,
225µm for array type

Spacing Limit:

4 adjacent dies cannot be at pitch
distances under 150µm

Probe Material:

Tungsten, Rhenium Tungsten, NT2 (new Tungsten),
and NP-7 (Palladium Alloy)

Probe Tip Lenght:

400µm to 450µm

Probe Tip Diameter:

20µm to 30µm (radius tip)

Maximum Device Size:

120mm x 120mm

Contact Resistance:

1 max (O.D.=70µm, I=10mA, Al pad)

Contact Force:

15g @ 50µm overdrive (ReW)
7.5g @ 50µm overdrive (NT-2)
3g @ 50µm overdrive (NP-7)

Maximum Current:

250mA dry switch

Temperature Range:

-43°C to 150°C

Lifecycle:

1 million touchdowns

VCPC 1

• Up to 16 dies
• Universal PC can be used

VCPC 2

• 32 - 64 dies
• Requires fully customized PCB

VCPC 2 N

• 32 - 64 dies
• Universal PCB can be used
• Requires custom interconnect PCB