Die uwe electronic bietet Burn-In Sockel der Firmen Wells-CTI und Sensata an. Die Burn-In Sockel eignen sich für die verschiedensten Anforderungen im Bereich des Burn-In Tests, aber auch hervorragend zur Programmierung von Bauteilen vor dem Verlöten auf eine Leiterplatte. Im Segment des Burn-In zählen hauptsächlich Halbleiterhersteller und spezialisierte Testfirmen zu den Kunden von uwe electronic. Im Bereich der Programmierung sind es hauptsächlich Kunden aus den Bereichen der Embedded-Technologies, der Lasertechnik aber auch Automotive oder Aerospace.
Die Sockel von Wells-CTI und Sensata zeichnen sich durch eine sehr hohe Langlebigkeit auch unter sehr anspruchsvollen Bedingungen, wie Hochtemperatur oder hoher Luftfeuchte aus.
CORWIL is recognized by the industry as a technology leader and is staffed by skilled engineers with many years of hands-on experience. The engineering staff consists of industry veterans with an average of 20 years experience in semiconductor assembly and test, including high volume manufacturing with IDM's and Asian subcontractors. CORWIL's engineers have published and presented papers and tutorials at various technical conferences worldwide.
CORWIL engineers are experts in package design, materials selection, assembly process compatibility, high yield manufacturing, and issues affecting package integrity. Our engineering team is organized by process areas, such as wafer thinning and dicing, Flip Chip, wire-bond, die picking and inspection, QFN and other plastic package assembly, and electrical test. In all these areas, the engineering team is working on the latest technologies.
In the area of dicing, CORWIL can produce ultra-thin .001" thick dice using the dice before grind (DBG) method. This is much thinner than the thickness of paper. In addition, CORWIL was one of the first companies to use Die Attach Film (DAF) which is critical for stacked die assemblies, and CORWIL now produces many millions of DAF die per month. In the area of Flip Chip, CORWIL has packaged many exotic Flip Chip designs, including ultra high bump count dice in excess of 3000 bumps. And, CORWIL has the ability to wirebond complicated ultra-fine-pitched BGA dies with multiple tiers. For next generation product development and one-of-a-kind devices, including devices with rerouted circuitry surgically done by Focused Ion Beam (FIB) or a Re-Distribution Layer of metal (RDL), customers trust CORWIL.
CORWIL's engineering resources work with customers to help identify and solve existing and potential IC packaging issues, sparing customers from costly packaging delays and failure analysis, and to develop manufacturable package solutions for high volume production. We understand that effective communication with our customers is what ensures the success of our customers' designs, proof of concepts, and final products.
CORWIL's engineering team can be your IC package design and development partner.
CORWIL's Test Services include:
Method 5004/5005 testing (Class B and Class S)
Custom test software development is available for CORWIL's digital test systems. We will work with consigned test systems and benchbox test setups as well.
Probecard & Interface Card Design & Fabrication
CORWIL can design and procure custom probe cards for wafer probing your IC wafers. CORWIL's wafer probe systems use standard rectangular probe cards and cantilever probes.
Wafer Electrical Probe
CORWIL uses an automated wafer stepper/prober that can interface to a variety of probe card configurations and test platforms. The available test platforms can be either CORWIL's in-house test system or customer-supplied test systems.
CORWIL is capable of performing final-part test for a variety of IC packages, including custom modules. As with wafer probe, the available test platforms can be CORWIL's in-house test system or customer-supplied.
CORWIL is QML listed and ITAR registered for Environmental Screening!
Full Mil-Std-883, Method 5004/5005 Testing (Class B and Class S)
All tests are performed in DSCC and ISO9001:2000 Certified Facilities in accordance with Military Standards.
The following are some of the more common tests:
Particle Impact Noise Detection Testing (PIND)
Method 2020, Condition A & B
Method 1008, Conditions A - D
Method 1010, Conditions A - C
Method 2001, Conditions A - E
Fine & Gross Leak Testing
Method 1014, Conditions A1 & C1
Bond Strength (destructive)
Non Destructive Bond Pull
Die Shear Strength
Substrate Attach Strength (stud pull)
Method 1015, Conditions A - E
Lid Torque (glass frit seal)
Method 1011, Conditions A - C
Method 2002, Conditions A - G
Method 1009, Conditions A - D
Method 2004, Conditions B1, B2 & D
Resistance to Solvents
Wafer Thinning & Polishing
CORWIL specializes in ultra-thin precision wafer thinning and polishing down to 25 microns. CORWIL routinely handles bumped wafers of wide-ranging bump heights and pitches and stocks a diverse assortment of front side tapes to provide the best protection for your wafers during processing.
Wafer grinding can create significant subsurface damage which can cause wafer damage when grinding is used to make wafers very thin, e.g. < 100 microns. CORWIL's dry polishing service removes much of the subsurface damage to enable safer die handling and yields.
Fully Automatic World Class Disco Wafer Dicing systems handle wafers ranging from fragments to 300mm diameter. Wafer cleanliness is maintained with surfactant injected into the DI water system and ESD is eliminated with CO2 bubblers and anti-static ionized work stations. Our experienced operators can take your multiple die type wafers with complex dicing patterns and save all dice or sacrifice some to retrieve the most important.
At CORWIL, no two customer products are alike and each product wafer will be diced with specially customized program parameters to minimize yield loss. Our narrowest cut line can be as low as 15 µm. CORWIL's engineering research has isolated 40 root causes of die chipping, which causes low die strength and poor yields. CORWIL's ability to dice with parameters optimized to each individual customer's device has led to CORWIL's success and technical leadership in the industry for chip-free, high-volume wafer dicing.
Dice Before Grind (DBG) CORWIL has developed proprietary techniques to allow for the safe singulation of IC devices from a wafer that has been ground very thin (as thin as 25 microns). The DBG process is principally used for singulating IC die when normal sawing would create unacceptable levels of chipping and edge damage.
Die Attach Film (DAF) CORWIL is one of the first companies to adopt Die Attach Film (DAF) in its wafer/die singulation process. This allows dice to be die-attached directly onto the leadframe or substrate without epoxy adhesive dispense. CORWIL also has a die chipping monitor which can be implemented to monitor yield on a real time basis. These and many other processes are available to reduce manufacturing cost and yield loss for customers.
Materials Materials processed at CORWIL include Silicon, GaAs, Sapphire, Quartz, SiGE, Laminates, Piezoelectric, Glass, and other materials.
CORWIL's Die Preparation Services include:
Pick & Place Automatic pick and place is available to place dice in:
Tape and Reel (paper or Surf tape)
Manual pick and place is available for:
Ultra-clean processing of optical or image chips
Die picking from wafer maps
Individual die I.D. recording is available
CORWIL offers automated and manual visual inspections to commercial, MIL-STD-883 (Class B or Class S), and Medical Electronics specifications.
Automated inspection using the latest August Technology and Camtek systems
100% visual inspection (high and low power) is available to the specifications you need
All operators are trained and certified to commercial, Mil-STD-883, Method 2010 Cond A & B, and customer specific requirements.
Quality & Service
Each order is entered on a custom traveler generated for each customer's specific requirements allowing for flexible process flows.
CORWIL processes tens of millions of dice per month and is the leading provider of wafer sawing and die visual inspection services for the leading heart pacemaker, RFID, hearing aid and defibrillator manufacturers.
CORWIL's Mil/Aero Business Unit is dedicated to satisfying the needs of the Military and Aerospace Markets. We are qualified to be the total value solution for all of your Military and Aerospace needs. We have vast experience in Hi-Rel processing and we are committed to manufacturing reliable, quality parts. CORWIL is certified to QML and ISO 9001:2000.
Our Processes include:
MIL-PRF-38535 QML'Q' ( Class B ) Certified
MIL-PRF-38535 QML'V' ( Class S ) Certification in process
Custom Flows ( Q+ or V- )
Source Control Drawings
CORWIL provides a wide range of ceramic packages that are suitable for Military and Aerospace use.
Our Packages include:
Cerdip and Sidebrazed
Flatpacks and Cerpacks
LCC and JLCC
TO Cans / Headers
CORWIL has the capabilities to assemble and manage a wide range of products for Military and Aerospace applications, including:
Discrete ICs: Diodes and Transistors
Analog and Mixed Signal ICs:
Voltage References / Voltage Regulators
AD / DA Converters
Enhanced COTS (Commercial Off The Shelf)
CORWIL offers a host of solutions to fill the need for cutting edge technology in hermetic packages. As many semiconductor manufacturers have moved to extended-temperature plastic processes (-40 to +85°C) there is a significant gap for some Military and Aerospace programs.
CORWIL can provide the service for these missing gaps.
Whether you need to place commercial die in a hermetic package or perform additional screening to an existing plastic, we can help you meet your requirements.
Assemble Commercial Die in Hermetic Packages
Extend Electrical Test to cover Mil-Temp Range (-55 to +125°C)
CORWIL's management has over 100 years of service in the Military/Aerospace industry. We believe that understanding the customer's needs is paramount to providing excellent service. We offer a selection of unique services that are available as part of a manufacturing order or as stand-alone items.
Radiation Management for high and low-dose rate (ELDR) testing