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Die uwe electronic bietet Burn-In Sockel der Firmen Wells-CTI und Sensata an. Die Burn-In Sockel eignen sich für die verschiedensten Anforderungen im Bereich des Burn-In Tests, aber auch hervorragend zur Programmierung von Bauteilen vor dem Verlöten auf eine Leiterplatte. Im Segment des Burn-In zählen hauptsächlich Halbleiterhersteller und spezialisierte Testfirmen zu den Kunden von uwe electronic. Im Bereich der Programmierung sind es hauptsächlich Kunden aus den Bereichen der Embedded-Technologies, der Lasertechnik aber auch Automotive oder Aerospace.

Die Sockel von Wells-CTI und Sensata zeichnen sich durch eine sehr hohe Langlebigkeit auch unter sehr anspruchsvollen Bedingungen, wie Hochtemperatur oder hoher Luftfeuchte aus.

BGA

1000-3 Serie

Wells CTI BGA 1000-3

654 Serie

Wells CTI BGA 1000-3

240 Serie

Wells CTI BGA 240

72X Serie

Wells CTI BGA 72X

CARRIER

621 Serie

Wells CTI CARRIER 621

625 Serie

Wells CTI CARRIER 625

626 Serie

Wells CTI CARRIER 626

628 Serie

Wells CTI CARRIER 628

629 Serie

Wells CTI CARRIER 629

635 Serie

Wells CTI CARRIER 635

646 Serie

Wells CTI CARRIER 646

647 Serie

Wells CTI CARRIER 647

CSP-BGA-QFN

71XP Serie

Wells CTI CSP-BGA-QFN 71XP

72X Serie

Wells CTI CSP-BGA-QFN 72x

715 Serie

Wells CTI CSP-BGA-QFN 715

718 Serie

Wells CTI CSP-BGA-QFN 718

772 Serie

Wells CTI CSP-BGA-QFN 772

774 Serie

Wells CTI CSP-BGA-QFN 774

775 Serie

Wells CTI CSP-BGA-QFN 775

776 Serie

Wells CTI CSP-BGA-QFN 776

776P Serie

Wells CTI CSP-BGA-QFN 772

790 Serie

Wells CTI CSP-BGA-QFN 790

CSP-FBGA

71XP Serie

Wells CTI CSP-BGA-QFN 790

654CSP Serie

Wells CTI CSP-FBGA 654SCP

703 Serie

Wells CTI CSP-FBGA 703

772 Serie

Wells CTI CSP-FBGA 772

774 Serie

Wells CTI CSP-BGA-QFN 774

775 Serie

Wells CTI CSP-FBGA 775

775E Serie

Wells CTI CSP-FBGA 775E

776 Serie

Wells CTI CSP-FBGA 776

777 Serie

Wells CTI CSP-BGA-QFN 777

778 Serie

Wells CTI CSP-FBGA 778

PGA

650 Serie

Wells CTI PGA 650

QFN-LGA

71XP Serie

Wells CTI QFN-LGA 71XP

72X Serie

Wells CTI QFN-LGA 72X

240 Serie

Wells CTI QFN-LGA 240

716 Serie

Wells CTI QFN-LGA 716

717 Serie

Wells CTI QFN-LGA 717

776P Serie

Wells CTI QFN-LGA 776P

790 Serie

Wells CTI QFN-LGA 790

QFP

680 Serie

Wells CTI QFP 790

TO-SOT

499 Serie

Wells CTI TO-SOT 499

611 Serie

Wells CTI TO-SOT 611

612 Serie

Wells CTI TO-SOT 612

678 Serie

Wells CTI TO-SOT 678

XSOP

648 Serie

Wells CTI XSOP 648

652 Serie

Wells CTI XSOP 652

652D Serie

Wells CTI XSOP 652D

656 Serie

Wells CTI XSOP 656

656T Serie

Wells CTI XSOP 656T

676 Serie

Wells CTI XSOP 676

696 Serie

Wells CTI XSOP 696

CORWIL is recognized by the industry as a technology leader and is staffed by skilled engineers with many years of hands-on experience. The engineering staff consists of industry veterans with an average of 20 years experience in semiconductor assembly and test, including high volume manufacturing with IDM's and Asian subcontractors. CORWIL's engineers have published and presented papers and tutorials at various technical conferences worldwide.

CORWIL engineers are experts in package design, materials selection, assembly process compatibility, high yield manufacturing, and issues affecting package integrity. Our engineering team is organized by process areas, such as wafer thinning and dicing, Flip Chip, wire-bond, die picking and inspection, QFN and other plastic package assembly, and electrical test. In all these areas, the engineering team is working on the latest technologies.

In the area of dicing, CORWIL can produce ultra-thin .001" thick dice using the dice before grind (DBG) method. This is much thinner than the thickness of paper. In addition, CORWIL was one of the first companies to use Die Attach Film (DAF) which is critical for stacked die assemblies, and CORWIL now produces many millions of DAF die per month. In the area of Flip Chip, CORWIL has packaged many exotic Flip Chip designs, including ultra high bump count dice in excess of 3000 bumps. And, CORWIL has the ability to wirebond complicated ultra-fine-pitched BGA dies with multiple tiers. For next generation product development and one-of-a-kind devices, including devices with rerouted circuitry surgically done by Focused Ion Beam (FIB) or a Re-Distribution Layer of metal (RDL), customers trust CORWIL.

CORWIL's engineering resources work with customers to help identify and solve existing and potential IC packaging issues, sparing customers from costly packaging delays and failure analysis, and to develop manufacturable package solutions for high volume production. We understand that effective communication with our customers is what ensures the success of our customers' designs, proof of concepts, and final products.

CORWIL's engineering team can be your IC package design and development partner.

CORWIL's Test Services include:

Environmental Test

  • Full Mil-Std-883
  • Method 5004/5005 testing (Class B and Class S)

Software Development

Custom test software development is available for CORWIL's digital test systems. We will work with consigned test systems and benchbox test setups as well.

Probecard & Interface Card Design & Fabrication

CORWIL can design and procure custom probe cards for wafer probing your IC wafers. CORWIL's wafer probe systems use standard rectangular probe cards and cantilever probes.

Wafer Electrical Probe

CORWIL uses an automated wafer stepper/prober that can interface to a variety of probe card configurations and test platforms. The available test platforms can be either CORWIL's in-house test system or customer-supplied test systems.

Final Test

CORWIL is capable of performing final-part test for a variety of IC packages, including custom modules. As with wafer probe, the available test platforms can be CORWIL's in-house test system or customer-supplied.

CORWIL is QML listed and ITAR registered for Environmental Screening!

Full Mil-Std-883, Method 5004/5005 Testing (Class B and Class S)

All tests are performed in DSCC and ISO9001:2000 Certified Facilities in accordance with Military Standards.

The following are some of the more common tests:

Particle Impact Noise Detection Testing (PIND)

Method 2020, Condition A & B

Stabilization Bake

Method 1008, Conditions A - D

Temperature Cycling

Method 1010, Conditions A - C

Centrifuge/Constant Acceleration

Method 2001, Conditions A - E

Fine & Gross Leak Testing

Method 1014, Conditions A1 & C1

Bond Strength (destructive)

Method 2011

Non Destructive Bond Pull

Method 2023

Die Shear Strength

Method 2019

Substrate Attach Strength (stud pull)

Method 2027

Burn-In

Method 1015, Conditions A - E

Lid Torque (glass frit seal)

Method 2024

Thermal Shock

Method 1011, Conditions A - C

Mechanical Shock

Method 2002, Conditions A - G

Salt Atmosphere

Method 1009, Conditions A - D

Solderability

Method 2003

Moisture Resistance

Method 1004

Lead Integrity

Method 2004, Conditions B1, B2 & D

Resistance to Solvents

Method 2015

Wafer Thinning & Polishing

CORWIL specializes in ultra-thin precision wafer thinning and polishing down to 25 microns. CORWIL routinely handles bumped wafers of wide-ranging bump heights and pitches and stocks a diverse assortment of front side tapes to provide the best protection for your wafers during processing.

Wafer grinding can create significant subsurface damage which can cause wafer damage when grinding is used to make wafers very thin, e.g. < 100 microns. CORWIL's dry polishing service removes much of the subsurface damage to enable safer die handling and yields.

Wafer Dicing

Fully Automatic World Class Disco Wafer Dicing systems handle wafers ranging from fragments to 300mm diameter. Wafer cleanliness is maintained with surfactant injected into the DI water system and ESD is eliminated with CO2 bubblers and anti-static ionized work stations. Our experienced operators can take your multiple die type wafers with complex dicing patterns and save all dice or sacrifice some to retrieve the most important.

At CORWIL, no two customer products are alike and each product wafer will be diced with specially customized program parameters to minimize yield loss. Our narrowest cut line can be as low as 15 µm. CORWIL's engineering research has isolated 40 root causes of die chipping, which causes low die strength and poor yields. CORWIL's ability to dice with parameters optimized to each individual customer's device has led to CORWIL's success and technical leadership in the industry for chip-free, high-volume wafer dicing.

 

Dice Before Grind (DBG)
CORWIL has developed proprietary techniques to allow for the safe singulation of IC devices from a wafer that has been ground very thin (as thin as 25 microns). The DBG process is principally used for singulating IC die when normal sawing would create unacceptable levels of chipping and edge damage.

Die Attach Film (DAF)
CORWIL is one of the first companies to adopt Die Attach Film (DAF) in its wafer/die singulation process. This allows dice to be die-attached directly onto the leadframe or substrate without epoxy adhesive dispense. CORWIL also has a die chipping monitor which can be implemented to monitor yield on a real time basis. These and many other processes are available to reduce manufacturing cost and yield loss for customers.

Materials
Materials processed at CORWIL include Silicon, GaAs, Sapphire, Quartz, SiGE, Laminates, Piezoelectric, Glass, and other materials.

Die Preparation

CORWIL's Die Preparation Services include:

Pick & Place
Automatic pick and place is available to place dice in:

    • Waffle packs
    • Tape and Reel (paper or Surf tape)
    • GelPack

Manual pick and place is available for:

    • Die-sensitive
    • Topside handling
    • Unpassivated
    • MEMs
    • Ultra-clean processing of optical or image chips
    • Die picking from wafer maps

Individual die I.D. recording is available

Die Inspection

CORWIL offers automated and manual visual inspections to commercial, MIL-STD-883 (Class B or Class S), and Medical Electronics specifications.

  • Automated inspection using the latest August Technology and Camtek systems
  • 100% visual inspection (high and low power) is available to the specifications you need
  • All operators are trained and certified to commercial, Mil-STD-883, Method 2010 Cond A & B, and customer specific requirements.

Quality & Service

Each order is entered on a custom traveler generated for each customer's specific requirements allowing for flexible process flows.

High Volume

CORWIL processes tens of millions of dice per month and is the leading provider of wafer sawing and die visual inspection services for the leading heart pacemaker, RFID, hearing aid and defibrillator manufacturers.

CORWIL's Mil/Aero Business Unit is dedicated to satisfying the needs of the Military and Aerospace Markets. We are qualified to be the total value solution for all of your Military and Aerospace needs. We have vast experience in Hi-Rel processing and we are committed to manufacturing reliable, quality parts. CORWIL is certified to QML and ISO 9001:2000.

Our Processes include:

  • MIL-PRF-38535 QML'Q' ( Class B ) Certified
  • MIL-PRF-38535 QML'V' ( Class S ) Certification in process
  • MIL-PRF-19500
  • Custom Flows ( Q+ or V- )
  • Source Control Drawings

MIL/Aerospace Packages

CORWIL provides a wide range of ceramic packages that are suitable for Military and Aerospace use.

Our Packages include:

  • Cerdip and Sidebrazed
  • Flatpacks and Cerpacks
  • SOIC
  • LCC and JLCC
  • PGA
  • TO Cans / Headers
  • Custom Packages

MIL/Aerospace Products

CORWIL has the capabilities to assemble and manage a wide range of products for Military and Aerospace applications, including:

  • Discrete ICs: Diodes and Transistors
  • Analog and Mixed Signal ICs:
  • Op Amps
  • Comparators
  • Voltage References / Voltage Regulators
  • AD / DA Converters

Enhanced COTS (Commercial Off The Shelf)

CORWIL offers a host of solutions to fill the need for cutting edge technology in hermetic packages. As many semiconductor manufacturers have moved to extended-temperature plastic processes (-40 to +85°C) there is a significant gap for some Military and Aerospace programs.

CORWIL can provide the service for these missing gaps.

Whether you need to place commercial die in a hermetic package or perform additional screening to an existing plastic, we can help you meet your requirements.

Options include:

  • Assemble Commercial Die in Hermetic Packages
  • Extend Electrical Test to cover Mil-Temp Range (-55 to +125°C)
  • Custom Options

Program Management

CORWIL's management has over 100 years of service in the Military/Aerospace industry. We believe that understanding the customer's needs is paramount to providing excellent service. We offer a selection of unique services that are available as part of a manufacturing order or as stand-alone items.

  • Radiation Management for high and low-dose rate (ELDR) testing
  • Discontinued Product Management
  • Engineering Services
  • Quick-turn Prototype Assembly
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