Offers test sockets for use on a wide range of packages (i.e., BGA, LGA, QFN, QFP, CSP, TSOP, SOP) and PoP; can be used for Multi-Parallelism, a total solution for the logic test socket.
Specifications
Package Type: FBGA, PoP, QFN, QFP, SOP etc.
Available pitch: 0.25P~
Characteristics: AP-Memory Bi-directional Test 0.4P Impedance Matching Coaxial Structure
Product Series
Package Type: 16LGA
Pitch: 0,5 mm
Characteristics: 8 Parallel Manual Test
Package Type: 100 QFP
Pitch: 0,5 mm
Characteristics: Kelvin Contact Test
Package Type: 251BGA
Pitch: 0,4 mm
Characteristics: Standard
Package Type: 1745BGA
Pitch: 1,0 mm
Characteristics: Air Coaxial 50Ω Matching
Package Type: 1249NSP
Pitch: 0,568 mm
Characteristics: Normal
Package Type: 1292BGA, 272BGA
Pitch: 0,4 mm
Characteristics: Bi-directional PoP Test Socket
Package Type: 1296BGA, 361BGA
Pitch: 0,4 mm
Characteristics: Adjoining PKG Test Socket
Package Type: 2021BGA
Pitch: 1,0 mm
Characteristics: 270W Cooling System Cover