Veröffentlicht: 27. April 2024

Uwe electronic Full-Service Provider für Sonderstecker mit gefederten Kontaktstiften

Die uwe electronic setzt auch im Bereich Medizin- und Prüftechnik den Schwerpunkt auf Kundenorientierung. Die Realisierung kundenspezifischer Sonderausführungen und Steckverbinder ist eine Herausforderung, die wir gerne und professionell meistern. Um einen kleinen Einblick in solche Speziallösungen zu bekommen, sind nachfolgend einige Sonderbaugruppen dargestellt, die wir realisieren konnten.

Es handelt sich um diverse Steckverbindungen auf der Basis von Federkontaktstiften, z.B. hochpolige, High-Density-Kontaktierungen bei Rastermaßen bis zu 0,4 mm. Wir freuen uns darauf, zukünftig auch Ihre spezifischen Anforderungen zu erfüllen.

Bei uwe electronic bekommen Kunden alles aus einer Hand: Entwicklung, Fertigung und Montage. So kann kontinuierlich eine hohe Produktqualität geboten werden, um auch besonders anspruchsvollen Kontaktierungsanforderungen gerecht zu werden.

Warum lohnt es sich, die Technologie gefederter Kontaktstifte zu nutzen?

Diese Technologie bietet wesentliche Vorteile bezüglich der Zuverlässigkeit, Leistungsfähigkeit und Effizienz verglichen mit konventionellen Technologien. Steckverbinder mit gefederten Kontaktstiften bieten:

• Vielseitigkeit bei der Montage und Gestaltung der Form
• Extrem hohe Materialdichte und Stabilität
• Niedriger und gleichbleibender Widerstand
• Sehr zuverlässiger Kontakt im Falle von Stößen, Vibration oder Beschleunigung
• Gleichbleibende Leistung vom ersten Einfedern an
• Millionen Federzyklen

Uwe electronic bietet:

• Komplette Steckerkonfektionierung inklusive Kabel / Schrumpfschlauch und Sonderstecker
• Komplette Steckersystem-Montage

Veröffentlicht: 27. April 2024

IC Assembly Highlights

CORWIL partners with customers to provide them with the highest-quality IC assembly services to achieve their goals. We help companies introduce their new products to market in the fastest time possible by providing high quality, quick-turn assembly. CORWIL assembles ICs in prototype and production volumes to help you qualify your designs and provide quality samples to your customers.

CORWIL understands that time is of the essence in this fast-paced technology. We use state-of-the-art machines in our facility to support and turn many different types of IC assemblies in as quickly as 4 hours. Our flexibility in meeting customer requirements and our superior customer service separate us from all other assembly subcontractors worldwide!

CORWIL's capabilities include:

• Ultra-fine pitch bonding
• A wide variety of QFN packages
• For BGAs - all Ball Configurations, Wire Counts, and Body Sizes
• For Custom and Module assemblies - Customer or CORWIL supplied substrates
• Sealing Method: dam and fill, transfer mold, open cavity, or CORWIL's proprietary temporary sealing method for easy access to die
• Standard cycle time: 5 working days; Quick-turns as fast as 4 hours

CORWIL is always looking to the future and investing in new equipment to match our customers' needs, help them stay ahead of product life cycles, and keep them on the forefront of emerging markets and technologies.

CORWIL's IC Assembly services include:

Wafer electrical probe

Full wafer preparation:

• Wafer grinding, thinning and polishing (75mm to 300mm wafer diameters)
• Wafer sawing and dicing (the first U.S. supplier to offer 300mm dicing and DBG - dice before grind)
• Die plating and pick and place
• Die inspection - manual and automated

IC package engineering & assembly:

• Die attach
• Wire bond (Aluminum and Gold)
• Flip Chip
• Encapsulation and transfer mold
• Substrate solder ball attach
• Device Singulation

Standard IC Packages Available

Hermetic & Ceramic

From wafer to finished product, CORWIL can deliver in as quickly as 4 hours! CORWIL assembles all types of hermetic and ceramic packages including:

• PGAs (pin-up or pin-down configurations-with and without heat sinks)
• Sidebraze
• Cerquad
• Quad Flat-Pack
• Cerdip, Cerpak
• Flat-Pack
• Ceramic SOIC
• LLC
• JLCC (PLCC equivalent)
• Metal Cans
• Headers

 

Plastic

CORWIL can assemble devices into Open Cavity plastic packages in prototype quantities in as quickly as 8 hours from receipt of the packages! Plastic Open Cavity package equivalents are available for:

• TSSOP
• MSOP
• SOIC
• PQFP
• And other package configurations

 

BGA

CORWIL's Ball Grid Array assembly capabilities include:

• Ultra-fine pitch bonding
• All Ball Configurations, Wire Counts, and Body Sizes
• Customer or CORWIL-supplied substrates
• Sealing Method: dam and fill, transfer mold, open cavity, or CORWIL's proprietary temporary sealing method for easy access to die
• Substrate design and fabrication

 

Flip Chip

CORWIL's Flip Chip product capabilities include:

• Flip Chip in package (FCIP) such as FCBGA and Flip Chip on board (FCOB)
• Organic laminates or ceramic substrates
• Single or multiple Flip Chip and wire-bonded IC's in hybrids or multi-chip modules
• Bonding of solder bumped dice to substrates with an accuracy as tight as 5 microns
• Solder joints are reflowed in nitrogen under tight temperature control and reflow profiles are available for eutectic and also for lead-free solder
• Gold stud bumping
• Studded die can be thermosonically joined to customer substrates, or soldered using a gold tolerant solder

 

QFN & DFN

CORWIL can assemble your IC die into a wide range of QFN and DFN options:

• Leadframes ranging from 3x3mm to 12x12mm body sizes
• Pin counts from 8 to 88 leads
• Custom leadframe design and fabrication in as little as 3 weeks

SIP/MCM Modules

CORWIL can design your custom module. Our multi-component assembly options include:

• Stacked die
• SMT components
• Package-on-package
• Combined Flip Chip
• Wirebond structures

 

Veröffentlicht: 27. April 2024

Uwe electronic Vertriebs GmbH represent CORWIL Technology Corporation in Central Europe.  Corwil is the premier, US based, IC assembly and test services subcontractor. Corwil offers full back-end assembly services starting from wafer sort, thinning & dicing through die-attach, wirebond, package sealing and final test. CORWIL has the experience to meet your most demanding challenges in Flip Chip assembly, aluminum and gold wire bonding, custom encapsulation and plastic molding, wafer probe, and wafer thinning, polishing and dicing.

Uwe electronic and CORWIL are dedicated to meeting customer expectations, producing excellent quality products, and providing superior service to its growing base of more than 1000 customers.

IC Assembly

Leading IC assembly subcontractor in the U.S. for quick-turn prototypes, small and medium size production lots, as well as full production volumes for high-reliability and mil-spec devices. From wafer to finished product.

SIP & MCM Modules

Uwe electronic and CORWIL can guide you through the process from design to assembly of SIP, MCM, and RF modules as well as Stacked Die Assemblies.

MIL & Aerospace Assembly & Testing

With DSCC certifications & ITAR registration, CORWIL is qualified to be the total value solution for all your Military and Aerospace IC assembly and test needs.

Wafer Thinning & Dicing

CORWIL's world-class wafer processing facility thins and dices Silicon, GaAs, Sapphire, Quartz, Laminates, Indium Phosphate, Glass and other materials in low & high volume quantities.

Environmental & Electrical Test

Test services include environmental test, software development, probe card and interface card design and fabrication, wafer electrical probe, and final test.

Engineering Services

CORWIL's engineering team stays at the forefront of semiconductor package design and process technology. CORWIL's engineering expertise has resulted in several proprietary manufacturing and packaging innovations which have solved customer product configuration and manufacturing problems.

Please contact Mr. Uwe Burkhartsmaier and Mr. Walter Viehweg to learn more about the possibilities of Corwil.

Veröffentlicht: 27. April 2024

SIP & MCM Module Options Available

SIPs (System in Package) and MCMs (Multi-Chip Modules) are substrates containing multiple interconnected components (SMT components, Flip Chips, WLCSP, and/or wirebonded ICs) whose body outline and leads or ball array conform to conventional IC package, such as a JEDEC registered BGA.

RF Modules

RF Modules are SIPs or MCMs that require special substrate design, materials, and soldering in order to achieve the high frequency and performance desired.

Stacked Assemblies

Stacked assemblies can be SIPs or MCMs in which some of the components in the circuit are stacked vertically on other components. For example, several ICs can be stacked and wirebonded on top of each other; an IC die may be stacked and wirebonded on top of a Flip Chip; or a SIP may be stacked on top of another SIP to form a POP (Package on Package) configuration.

 

SIP & MCM Module Design & Assembly

Materials

Material selection is critical to product quality and functionality. CORWIL's vast base of materials knowledge and experience with thousands of diverse assembly projects is available to help you to optimize your design.

BOM Selection (SIP/MCM Modules)

CORWIL's staff can assist you in the selection, sourcing and purchasing of the Bill of Materials for your SIP and MCM modules projects.

Project Management

Introducing new products in new packages is a complex, demanding activity. For many years, CORWIL has managed complex projects ranging from new package introductions to technology transfers into large volume offshore factories.

Package Selection

CORWIL's engineers are available to advise you on the ideal IC package for your IC, circuit function, and product application.

Substrate Design

CORWIL maintains relationships with a number of design experts and leading substrate suppliers around the world to better serve you.