Memory devices are tested in very high volumes – which makes cycle time, repeatability and service life the decisive factors. Our memory test sockets are precision injection-moulded on the basis of patented technology, so even fine pitches from 0.3 mm can be manufactured reliably and with consistent quality.
Versions are available for the common memory packages from 216BGA to 546BGA as well as for 48TSOP. Options such as a GPS alignment system, a floating type version and the hybrid BK type are also available.
Product Series
Package Type: 216BGA
Pitch: 0,4 mm
Customizing: 216FBGA- 12,0x12,0x1,02T
Socket Size: 27,0x17,0x4,65
Package Type: 288BGA
Pitch: 0,35 mm
Customizing: 288FBGA- 14,0x14,0x0,76T
Socket Size: 27,0x17,0x3,75
Package Type: 546BGA
Pitch: 0,3 mm
Customizing: 546FBGA- 14,0x16,0x0,76T
Socket Size: 27,0x17,0x3,15
Package Type: 266BGA
Pitch: 0,3 mm
Customizing: 266-FBGA- 14,0x14,0x0,62T
Socket Size: 27,0x17,0x3,75
Package Type: 383BGA
Pitch: 0,4 mm
Customizing: 383FBGA- 9,0x9,0x1,18T
Socket Size: 227,0x17,0x5,40
Package Type: 48TSOP
Pitch: 0,5 mm
Customizing: 48TSOP-1-20,0x12,4x1,20T
Socket Size: 28,0x19,0x4,75
We build sockets for other memory types and pitches to your specification – simply send us the drawing of your device.
