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Uwe electronic offers highly efficient heat sinks as well as special combinations of heat sinks and fans for BGA cooling and CPU cooling. All heat sinks are manufactured with the high performance forging technology, which allows a high heat dissipation on small installation space. This is of particular interest for embedded cooling solutions. There are special series developed on BGA chips, which can be mounted very easily with a clip system. All heat sinks can be supplied with a heat conducting foil / thermal pad.

Further heat sinks are designed for the cooling of Peltier elements. All heat sinks are available in different sizes, shapes and fin lengths depending on the requirements.