Kelvin probe head is designed using LEENO’s best processing technology. The Probe Head can have a long life span using optimized Kelvin spring probe contacts which also can be used for high current wafer testing. Fine pitch spring probes or Cobra pins can provide 92um pitch with greater than 30K points on the Probe Card.
Specifications
Package type: Wafer (WLCSP)
Pitch: 92um~
Characteristics: Kelvin, Cobra, RF
Product Series
1 Die Bump Count: 3600 Bump
Pitch: 0,092 mm
Characteristics: 1 Site, Spring Contact Type
1 Die Bump Count: 3600 Bump (More than 28000 Pin)
Pitch: 0,14 mm
Characteristics: 8 Site, No Skip Cobra Type
1 Die Bump Count: 12 Bump
Pitch: 0,4 mm
Characteristics: 16 Site, 2-Die Skip, Mix Probe Type (Kelvin + Non Kelvin)
1 Die Bump Count: 29 Bump
Pitch: 0,35 mm
Characteristics: 8 Site, 1-Die Skip Kelvin Type
1 Die Bump Count: 34 Bump
Pitch: 0,4 mm
Characteristics: 8 Site, 2-Die Skip, Signal Length 2,05 mm
1 Die Bump Count: 14 Bump
Pitch: 0,4 mm
Characteristics: 4 Site, No Skip Kelvin Type
1 Die Bump Count: 60 Bump
Pitch: 0,4 mm
Characteristics: 16 Site, 2-Die Skip, Signal Lenght 2,5 mm
1 Die Bump Count: 40 Bump
Pitch: 0,4 mm
Characteristics: 8 Site, No Skip Kelvin Type
1 Die Bump Count: 134 Bump
Pitch: 0,26 mm
Characteristics: 4 Site, No Skip Air Coaxial Type