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Probe Head

leeno probe headKelvin probe head is designed using LEENO’s best processing technology. The Probe Head can have a long life span using optimized Kelvin spring probe contacts which also can be used for high current wafer testing. Fine pitch spring probes or Cobra pins can provide 92um pitch with greater than 30K points on the Probe Card.

Specifications

Package type: Wafer (WLCSP)
Pitch: 92um~
Characteristics: Kelvin, Cobra, RF

Product Series

1 Die Bump Count: 3600 Bump

leeno probe head 3600bump

Pitch: 0,092 mm
Characteristics: 1 Site, Spring Contact Type

1 Die Bump Count: 3600 Bump (More than 28000 Pin)

leeno probe head 3600bump 28000pins

Pitch: 0,14 mm
Characteristics: 8 Site, No Skip Cobra Type

1 Die Bump Count: 12 Bump

leeno probe head 12bump

Pitch: 0,4 mm
Characteristics: 16 Site, 2-Die Skip, Mix Probe Type (Kelvin + Non Kelvin)

1 Die Bump Count: 29 Bump

leeno probe head 29bump

Pitch: 0,35 mm
Characteristics: 8 Site, 1-Die Skip Kelvin Type

1 Die Bump Count: 34 Bump

leeno probe head 34bump

Pitch: 0,4 mm
Characteristics: 8 Site, 2-Die Skip, Signal Length 2,05 mm

1 Die Bump Count: 14 Bump

leeno probe head 14bump

Pitch: 0,4 mm
Characteristics: 4 Site, No Skip Kelvin Type

1 Die Bump Count: 60 Bump

leeno probe head 60bump

Pitch: 0,4 mm
Characteristics: 16 Site, 2-Die Skip, Signal Lenght 2,5 mm

1 Die Bump Count: 40 Bump

leeno probe head 40bump

Pitch: 0,4 mm
Characteristics: 8 Site, No Skip Kelvin Type

1 Die Bump Count: 134 Bump

leeno probe head 134bump

Pitch: 0,26 mm
Characteristics: 4 Site, No Skip Air Coaxial Type