Camera modules are a special case in test: the module must not only be contacted electrically but also aligned optically with precision and held securely in place. Our camera module sockets are designed for all SMD versions and work with special grippers plus an additional connection clip that establishes a particularly precise contact.
Versions
- Single face up and single face down: for focus, calibration and DC tests
- Dual and quad face up: for testing optical image stabilisation (OIS) with several modules at once
- Raw material test: finest pitch of 0.15 mm, specifically for the voice coil motor bonding process
Key technical data
- Pitch: 0.35 mm as standard, 0.15 mm for raw material testing
- Test principle: coupling probe at a defined contact point
- Design: compact, conceived as a complete interface solution
Produkt Serie
Sockeltyp: Single face up type
Socket Type: Single face up type
Pitch: 0,35 mm
Charakteristics: Focusing, Calibration, DC test
Sockeltyp: Single face down type
Socket Type: Single face down type
Pitch: 0,35 mm
Charakteristics: Focusion, Calibration, DC test
Sockeltyp: Dual and Quad face up type
Socket Type: Dual and Quad face up type
Pitch: 0,35 mm
Charakteristics: Optical Image Stabilizer (OIS) test
Sockeltyp: Kameramodul Rohmaterialtest
Socket Type: Camera Module raw material test
Pitch: 0,15 mm
Charakteristics: Fine Pitch raw material test Previous voice coil motor adhesion process







