BGA devices dominate wherever many terminals have to fit into a small area – and that is exactly where the challenges of testing lie: fine pitches, several hundred to several thousand contacts, and correspondingly high cumulative forces. Our BGA and logic test sockets are designed for these requirements.
A spring-mounted nest (floating nest) aligns the device before its solder balls meet the contacts. The device is pre-centred, lateral forces are avoided, and both the solder balls and the contact tips are protected – a decisive factor for service life in high-volume testing.
For lead-free solder balls we use contacts specifically matched to the harder alloys: a harder, wear-resistant plating, a more robust base material, around 30 % higher spring force and a compact four-point crown that reliably penetrates the oxide layer even at fine pitch.
Supported packages and pitches
- Packages: BGA, FBGA, CSP-BGA, LGA, QFN, QFP, SOP, TSOP and package-on-package (PoP)
- Pitch range: 0.25 mm to 1.0 mm depending on design
- Multi-parallelism: several devices in one socket, e.g. 16LGA in 8-fold parallel operation
- Examples from the range: 100QFP, 251BGA, 1292BGA and 1296BGA at 0.4 mm pitch, 1745BGA and 2021BGA at 1.0 mm pitch with coaxial matching and cooling system cover up to 270 W
- Optionally with Kelvin contacts for four-wire measurement (see Kelvin test sockets)
