Test time per device is the biggest cost driver in production test. Multisite test sockets address exactly that: they contact several devices simultaneously, so handling and test times are spread across multiple devices. Throughput rises without the need for a second test station.
Three variants
- Strip test sockets: entire panels are contacted in one go – a proven approach, now available for both automatic loading and manual setup, with significantly improved productivity and reproducibility.
- Wafer-level test: custom interposer designs that work without a separate nest – often as a precursor to volume production.
- Multiple testing of individual devices: one solution replaces several sockets connected in sequence. This saves space on the load board and allows modular designs with interchangeable inserts.
The modular approach in particular pays off in the long run: interchangeable inserts allow different devices to be tested on the same base platform. This lowers development costs per device and considerably extends the useful life of the overall solution.
