Where a very large number of contact points at very fine pitch have to be approached simultaneously on the wafer, the probe head is the tool of choice. Our Kelvin probe heads are built on LEENO's process technology and work with optimised four-pole Kelvin spring contacts – this considerably extends service life and makes wafer testing with high currents manageable.
Performance data
- Pitch: from 92 µm (fine-pitch spring probes)
- Contact points: more than 30,000 achievable on one probe card
- Contact types: Kelvin (four-pole), Cobra pins and RF versions
- Multiplexing: variants for 4-fold, 8-fold and 16-fold parallel operation
Product Series
1 Die Bump Count: 3600 Bump
Pitch: 0,092 mm
Characteristics: 1 Site, Spring Contact Type
1 Die Bump Count: 3600 Bump (More than 28000 Pin)
Pitch: 0,14 mm
Characteristics: 8 Site, No Skip Cobra Type
1 Die Bump Count: 12 Bump
Pitch: 0,4 mm
Characteristics: 16 Site, 2-Die Skip, Mix Probe Type (Kelvin + Non Kelvin)
1 Die Bump Count: 29 Bump
Pitch: 0,35 mm
Characteristics: 8 Site, 1-Die Skip Kelvin Type
1 Die Bump Count: 34 Bump
Pitch: 0,4 mm
Characteristics: 8 Site, 2-Die Skip, Signal Length 2,05 mm
1 Die Bump Count: 14 Bump
Pitch: 0,4 mm
Characteristics: 4 Site, No Skip Kelvin Type
1 Die Bump Count: 60 Bump
Pitch: 0,4 mm
Characteristics: 16 Site, 2-Die Skip, Signal Lenght 2,5 mm
1 Die Bump Count: 40 Bump
Pitch: 0,4 mm
Characteristics: 8 Site, No Skip Kelvin Type
1 Die Bump Count: 134 Bump
Pitch: 0,26 mm
Characteristics: 4 Site, No Skip Air Coaxial Type
For applications with lower contact counts and high cost pressure, it is worth looking at our WLCSP interposer sockets before deciding – they are around 20 % cheaper across the life cycle.
