Removable BGA heatsink (Clip mounting)
The new passive BGA heatsinks with clipset solution are extremly user-friendly. The classic heatsink needs a bolted connection or adhesive joint, whereas the highly-efficient clipset solution with its plastic clip is very easy to install. Thus, adhesive or assembly holes and time-consuming preparatory work can be omitted. The heatsink can be removed easily for testing or repairing purposes. The functionality is guaranteed due to an elimination of frequently occuring weak points, e.g. tiredness of the adhesive or easing of the bolts because of vibration. The clip creates a constant compression. The best heat transfer will be arranged by heat conductor pads between the heatsink and component.